Products
A total of 68 products were found for you
E200
- Intel® Apollo Lake platform Pentium J4205 / Celeron J3455
- 1 HDMI
- 2 LAN (2 x Intel i226-V)
- 3 USB3.0, 1 USB2.0
- 1 RS-232/422/485, 1 RS-232, 2 RS-232/485
- Ultra Compact footprint
E201
- Intel® Apollo Lake platform Pentium J4205 / Celeron J3455
- 1 HDMI
- 2 LAN (2 x Intel i226-V)
- 3 USB 3.0, 1 USB 2.0；1 x RS-232/485/422, 1 x RS-232
- 4 DI, 4 DO, 2 CANBus
- Compact footprint
E205
- Intel® Apollo Lake platform Pentium J4205 / Celeron J3455
- 1 HDMI
- 2 Intel i225-V GbE LAN
- 3 USB3.0, 1 USB2.0
- 1 RS-232/422/485, 1 RS-232 (Optional)
- Ultra Compact footprint
E211
- Intel® Atom / Celeron Elkhart Lake X6425E/J6412/ N6210
- 3 LAN (2 x Intel i210, 1 x Intel i226)
- 2 USB 3.0, 2 USB 2.0
- 1 RS-232/422/485, 1 RS-232, 2 RS-232/485
- Ultra Compact footprint
E213
- Intel® Atom/Celeron X6425E/J6412/ N6210
- 3 LAN (2 x Intel i210 supports PoE, 1 x Intel i226)
- 2 USB 3.0, 2 USB 2.0
- 1 RS-232/422/485, 1 RS-232
- 2 Light Source, 2 Trigger, 8 DI/DO, 2 Encoder
- Ultra Compact footprint
Intel® Celeron CPU
LAN*3 COM*2 USB*2
DI/DO*8, with Trigger & Light Source
Motion Control/Machine Vision
E215
- Intel® Atom / Celeron Elkhart Lake X6425E/J6412/ N6210
- 3 LAN (2 x Intel i210, 1 x Intel i226)
- 2 USB 3.0, 2 USB 2.0
- 1 RS-232/422/485, 1 RS-232(Optional)
- Supports 4G/5G, Wi-Fi module expansion
- Ultra Compact footprint
Intel® Atom / Celeron Elkhart Lake X6425E/J6412/ N6210 CPU
LAN*3 COM*2 USB*5
Motion Control/Machine Vision
E215-C
- Intel® Atom / Celeron Elkhart Lake X6425E/J6412/ N6210
- 1 LAN (1 x Intel i226)
- 2 USB 3.0, 2 USB 2.0
- 1 RS-232/422/485
- Supports 4G/5G, Wi-Fi module expansion
- Ultra Compact footprint
E225
- Intel® Alder Lake-N N97/i3-N305
- 3 LAN (2 x Intel i210, 1 x Realtek RTL8111H)
- 3 USB 3.0, 1 USB 2.0
- 1 RS-232/422/485,1 RS-232(Optional)
- Supports 4G/5G, Wi-Fi module expansion
- Ultra Compact footprint
E225-C
- Intel® Alder Lake-N N97/i3-N305
- 1 LAN (1 x Realtek RTL8111H)
- 3 USB 3.0, 1 USB 2.0
- 1 RS-232/422/485
- Supports 4G/5G, Wi-Fi module expansion
- Ultra Compact footprint
E7201
- Intel® Alder Lake-N N97/i3-N305
- 5 LAN (4 x Intel i210, 1 x Realtek RTL8111H)
- 3 USB3.0, 1 USB2.0
- 1 x RS-232/RS-485/422, 1 x RS-232, 2 x RS-485
- 16 DI/ 16 DO
- Ultra Compact footprint
Intel® Alder Lake N N97/ i3-N305 CPU
LAN*4 COM*4 USB*4
16 DI/ 16 DO
Motion Control/Machine Vision
E721
- Intel® Alder Lake N N97/ i3-N305 CPU
- 3 LAN (2 x Intel i210, 1 x Realtek RTL8111H)
- 1 RS-232/422/485, 1 RS-232, 2 RS-232/485
- 3 USB 3.0, 1 USB 2.0
- Supports 4G/5G, Wi-Fi module expansion
- Ultra Compact footprint
E723
- Intel® Alder Lake-N N97/i3-N305 Processor
- 3 LAN (2 x Intel i210 PoE optional, 1 x Realtek RTL8111H)
- 1 RS-232/422/485,1 RS-232
- 3 USB3.0, 1 USB2.0
- 2 Light Source, 2 Trigger, 8 DI,8 DO,2 Encoder
- Ultra Compact footprint
Intel® Alder Lake N N97/ i3-N305 CPU
LAN*3 COM*2 USB*4
8DI/8DO with Light Source & Trigger, 2 Encoder
Motion Control/Machine Vision
E726
- Intel® Alder Lake-N N97/i3-N305 Processor
- 5 LAN (4 x Intel i210, PoE optional; 1 x Realtek RTL8111H)
- 3 USB 3.0, 3 USB 2.0
- 1 RS-232/422/485, 1 RS-232
- Supports 4G/5G, Wi-Fi module expansion
- Ultra Compact footprint
E727
- Intel® Alder Lake-N N97/i3-N305 Processor
- 3 LAN (2 x Intel i210; 1 x Realtek RTL8111H)
- 7 USB 3.0, 1 USB 2.0
- 1 RS-232/422/485, 1 RS-232
- Supports 4G/5G, Wi-Fi module expansion
- Ultra Compact footprint
M1120
- Intel® 12th generation Core™i3/ i5/ i7 CPU
- Dual channel DDR4-3200, Max. 64GB memory
- 3 USB Type-C (1 supports DP function)
- 4 GbE LAN (4 x Intel i210)
- 1 RS-232/422/485,2 RS-232,3 RS-485
- 24 DI, 20 DO
- 2 CANBus, 2 Encode
- Modular and cable-free high reliability design
Intel® 12th generation Core™i3/ i5/ i7 CPU
COM*6 LAN*4 Type-C *3
24 DI/20 DO, 2CANBus, 2 Encoder
Motion Control/Machine Vision/AMR
E500
- Intel® 6th to 9th generation Core™i3/ i5/ i7 CPU Processor
- 3 LAN (2 x Intel i210, 1 x Intel i219)
- 3 independent display via 2 DP and 1 VGA
- 4 USB 3.0, 2 USB 2.0
- 1 RS-232, 1 RS-232/422/485
- Supports 4G/5G, Wi-Fi module expansion
Intel® 6th to 9th generation Core™i3/ i5/ i7 CPU
LAN*3 COM*2 USB*3
Motion Control/Machine Vision
E510
- Intel® 6th to 9th generation Core™ i3/ i5/ i7 Processor
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 2 DP and 1 VGA
- 4 USB 3.0, 2 USB 2.0
- 1 RS-232, 1 RS-232/422/485
- 16 DI, 16 DO
- Supports 4G/5G, Wi-Fi module expansion
Intel® 6th to 9th generation Core™i3/ i5/ i7 CPU
LAN*6 COM*2 USB*6, 16DI/16DO
Motion Control/Machine Vision
E511
- Intel® 6th to 9th generation Core™ i3/ i5/ i7 Processor
- 3 LAN (2 x Intel i210, 1 x Intel i219)
- 3 independent display via 2 DP and 1 VGA
- 4 USB 3.0, 4 USB 2.0
- 1 RS-232/422/485, 2 RS-232/485, 3 RS-232
- Supports 4G/5G, Wi-Fi module expansion
Intel® 6th to 9th generation Core™ i3/ i5/ i7 CPU
LAN*3 COM*6 USB*8
Motion Control/Machine Vision
E512
- Intel® 6th to 9th generation Core™ i3/ i5/ i7 Processor
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 2 DP and 1 VGA
- 4 USB 3.0, 4 USB 2.0
- 1 RS-232/422/485, 2 RS-232, 1 RS-485
- Supports 4G/5G, Wi-Fi module expansion
Intel® 6th to 9th generation Core™i3/ i5/ i7 CPU
LAN*6 COM*4 USB*8
Motion Control/Machine Vision
E500A
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- 3 LAN (2 x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 4 USB 3.0, 2 USB 2.0 (H420E) or 6 USB3.0 (Q470)
- 1 RS-232, 1 RS-232/422/485
- Supports 4G/5G, Wi-Fi module expansion
Intel® 10-11th generation Core™ i3/ i5/ i7 CPU
LAN*3 COM*2 USB*6
Motion Control/Machine Vision
E510A
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 4 USB 3.0, 2 USB 2.0 (H420E) or 6 USB3.0 (H470/Q470)
- 1 RS-232, 1 RS-232/422/485
- 16 DI, 16 DO
- Supports 4G/5G, Wi-Fi module expansion
Intel® 10-11th generation Core™ i3/ i5/ i7 CPU
LAN*6 COM*2 USB*6
16 DI/16 DO
Motion Control/Machine Vision
E511A
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- 3 LAN (2 x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 4 USB3.0, 4 USB2.0 (H420E) or 6 USB3.0,2USB2.0 (H470/Q470)
- 1 RS-232/422/485, 2 RS-232/485, 3 RS-232
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Intel® 10-11th generation Core™ i3/ i5/ i7 CPU
LAN*3 COM*6 USB*8
Motion Control/Machine Vision
E512A
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 4 USB3.0, 4 USB2.0 (H420E) or 6 USB3.0,2 USB2.0 (H470/Q470)
- 1 RS-232/422/485, 2 RS-232, 1 RS-485
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Intel® 10-11th generation Core™ i3/ i5/ i7 CPU
LAN*6 COM*4 USB*8
Motion Control/Machine Vision
E550
- Intel® 6th to 9th generation Core™ i3/ i5/ i7 Processor
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 2 DP and 1 VGA
- 4 USB 3.0, 2 USB 2.0
- 1 RS-232/422/485, 1RS-232
- 16 DI, 16 DO
- 1 PCIe Gen3 x16, 1 PCIe Gen2 x4 (x2signal) or PCIs lot
- Supports 4G/5G, Wi-Fi module expansion
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
E522
- Intel® 6th to 9th generation Core™ i3/ i5/ i7 Processor
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 2 DP and 1 VGA
- 4 USB 3.0, 4 USB 2.0
- 1RS-232/422/485,2 RS-232/485, 1 RS-232
- 1 PCIe Gen3 x16, 1 PCIe Gen2 x4 (x2 signal),2 PCI slots
- Supports 4G/5G, Wi-Fi module expansion
Intel® 6th to 9th generation Core™ i3/ i5/ i7 Processor
LAN*6 COM*4 USB*8, Expansion Slots*4
Machine Vision/Motion Control
E551
- Intel® 6th to 9th generation Core™ i3/ i5/ i7 Processor
- H110 Chipset
- 3 GbE LAN (2 x Intel i210-AT, 1 x Intel i219-LM)
- 3 independent display via 2 DP and 1 VGA
- 4 USB3.0,4 USB2.0
- 1 RS-232/422/485, 2 RS-232/485, 3 RS-232
- 1 x PCIe 3.0 x16 , 1 x PCIe 2.0 x4 ( x2 signal )/PCIslot
- Supports 4G/5G, Wi-Fi module expansion
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
E552
- Intel® 6th to 9th generation Core™ i3/ i5/ i7 Processor
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 2 DP and 1 VGA
- 4 USB 3.0, 4 USB 2.0
- 2 RS-232, 1 RS-485, 1 RS-485/232
- 1 PCIe Gen3 x16, 1 PCIe Gen2 x4 (x2signal) or PCI slot
- Supports 4G/5G, Wi-Fi module expansion
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
E530A
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- Q470 / H470 / H420E Chipset
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 4 USB 3.0, 2 USB 2.0(H420E) or 6 USB3.0 (Q470/H470)
- 1 RS-232, 1 RS-232/422/485
- 16 DI, 16 DO
- 1 PCIe x16, 1 PCIe x4 (x2signal )or 1 PCI
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
E55N
- Intel® 6th to 9th generation Core™i3/ i5/ i7 Processor
- 3 LAN (2 x Intel i210, 1 x Intel i219)
- 3 independent display via 2 DP and 1 VGA
- 4 USB 3.0, 2 USB 2.0
- 1 RS-232, 1 RS-232/422/485
- 1 PCIe Gen3 x16, 1 PCIe Gen2 x4 (x2 signal) or PCI slot
- Supports 4G/5G, Wi-Fi module expansion
Intel® 6th to 9th generation Core™i3/ i5/ i7 Processor
LAN*3 COM*2 USB*6 Expansion Slot*2
Machine Vision/Motion Control
E521
- Intel® 6th to 9th generation Core™ i3/ i5/ i7 Processor
- 3 LAN (2 x Intel i210, 1 x Intel i219)
- 3 independent display via 2 DP and 1 VGA
- 4 USB 3.0, 4 USB 2.0
- 1 RS-232/422/485, 3 RS-232/485, 2 RS-232
- 1 PCIe Gen3 x16, 1 PCIe Gen2 x4 (x2signal),2 PCI slots
- Supports 4G/5G, Wi-Fi module expansion
Intel® 6th to 9th generation Core™ i3/ i5/ i7 Processor
LAN*3 COM*6 USB*8, Expansion Slot*4
Machine Vision/Motion Control
E550A
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 4 USB 3.0, 2 USB 2.0 (H420E) or 6 USB3.0 (H670/Q470 support 2 SATA RAID (support RAID 0/RAID 1, switchable in BIOS)
- 1 RS-232, 1 RS-232/422/485
- 16 DI, 16 DO
- 1 PCIe 3.0 x16, 1 PCIe 3.0 x4 (x2 signal) or PCI expansion slot
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
E551A
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- 3 LAN (2 x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 4 USB3.0, 4 USB2.0 (H420E) or 6 USB3.0,2USB2.0 (H470/Q470)
- 1 RS-232/422/485, 2 RS-232/485, 3 RS-232
- 1 PCIe 3.0 x16, 1 PCIe 3.0 x4 (x2 signal) or PCI expansion slot
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
E520
- Intel® 6th to 9th generation Core™ i3/ i5/ i7 Processor
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 2 DP and 1 VGA
- 4 USB 3.0, 2 USB 2.0
- 1 RS-232/422/485, 1RS-232
- 16 DI, 16 DO
- 1 PCIe Gen3 x16, 1 PCIe Gen2 x4 (x2 signal), 2 PCI slot
- Supports 4G/5G, Wi-Fi module expansion
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
E521A
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- 3 LAN (2 x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 4 USB3.0, 4 USB2.0 (H420E) or 6 USB3.0,2USB2.0 (H470/Q470)
- 1 RS-232/422/485, 2 RS-232/485, 3 RS-232
- 1 PCIe 3.0 x16, 1 PCIe 3.0 x4 (x2 signal) , 2 PCI
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
E522A
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 4 USB3.0, 4 USB2.0 (H420E) or6 USB3.0, 2 USB2.0 (H470/Q470)
- 1 RS-232/422/485, 2 RS-232, 1 RS-485
- 1 PCIe 3.0 x16, 1 PCIe 3.0 x4 (x2 signal) , 2 PCI
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
E522-AS
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- Q470 / H470
- 11 GbE LAN (10 x Intel i210 supports 8 PoE, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 6 USB3.0
- 1 RS-232/422/485, 1 RS-232
- 1 PCIe 3.0 x16, 1 PCIe 3.0 x4 (x2 signal) , 2 PCI
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
P101-1F
- Intel® Atom® J6412/N6210/X6425E Processor
- 3 x LAN (2 x Intel i210 supports PoE, 1 x Intel i226)
- 2 x USB 3.0, 2 x USB 2.0
- 1 x RS-232/422/485, 1 x RS-232
- 10.1″ industrial-grade LCD screen
- 10-point capacitive or 5-wire resistive touch screen
- Front panel IP65 protection
Intel® Atom® J6412/N6210/X6425E Processor 3 x LAN (2 x Intel i210 supports PoE, 1 x Intel i226) 2 x USB 3.0, 2 x USB 2.0 1 x RS-232/422/485, 1 x RS-232 10.1″ industrial-grade LCD screen 10-point capacitive or 5-wire resistive touch screen Front panel IP65 protection
E521-C
- Intel® 12-14th Gen Core i3/ i5/ i7 Series Processors
- H610/H670/Q670 Chipset
- 3 LAN (2 x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 1 RS-232/422/485, 3 RS-232/485, 2 RS-232
- 4 USB 3.2, 4 USB 2.0 (H610) or 6 USB3.2, 2 USB20 (H670/Q670 support 2 SATA RAID (support RAID 0/RAID 1, switchable in BIOS)
- 1 PCIe 5.0 x16, 1 PCIe 4.0 x4(x2 signal ) , 2 PCI
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
P121-2F
- Intel® Atom® J6412/N6210/X6425E Processor
- 3 x LAN (2 x Intel i210 supports PoE, 1 x Intel i226)
- 2 x USB 3.0, 2 x USB 2.0
- 1 x RS-232/422/485, 1 x RS-232
- 12.1″ industrial-grade LCD screen
- 10-point capacitive touch screen
- Front panel IP65 protection
Intel® Atom® J6412/N6210/X6425E Processor
LAN*3 COM*2 USB*4
IP65, 12.1″ industrial-grade LCD screen
P156-2F
- Intel® Atom® J6412/N6210/X6425E Processor
- 3 x LAN (2 x Intel i210 supports PoE, 1 x Intel i226)
- 2 x USB 3.0, 2 x USB 2.0
- 1 x RS-232/422/485, 1 x RS-232
- 15.6″ industrial-grade LCD screen
- 10-point capacitive or 4-wire resistive touch screen
- Front panel IP65 protection
Intel® Atom® J6412/N6210/X6425E Processor 3 x LAN (2 x Intel i210 supports PoE, 1 x Intel i226) 2 x USB 3.0, 2 x USB 2.0 1 x RS-232/422/485, 1 x RS-232 15.6″ industrial-grade LCD screen 10-point capacitive or 4-wire resistive touch screen Front panel IP65 protection
E531-C
- Intel® 12-14th Gen Core™ i3/ i5/ i7 Series
- H610/H670/Q670 Chipset
- 3 independent display via 1 DP,1 HDMI and 1 VGA
- 3GbE LAN(2x Intel i210, 1 x Intel i219)
- 1 RS-232/422/485, 3 RS-232/485, 2 RS-232
- 4 USB3.2, 4 USB2.0 (H610) or 6 USB3.2, 2 USB2.0 (H670/Q670 support 2 SATA RAID (support RAID 0/RAID 1, switchable in BIOS)
- 1 PCIe 5.0 x16, 1 PCIe 4.0 x2(H610) ; 1 PCIe 5.0 x16 or 2 PCIe x8, 1 PCIe 4.0 x2(H670/Q670)
- 800W Power Supply
Intel® 12-14th Gen Core™ i3/ i5/ i7 Series CPU
LAN*3 COM*6 USB*8, Expansion Slot*4
800W Built-in Power
Motion Control/Machine Vision/Edge AI
P215-2F
- Intel® Atom® J6412 Processor
- 3 x LAN (2 x Intel i210 supports PoE, 1 x Intel i226)
- 1 DP, 1 HDMI
- 2 x USB 3.0, 2 x USB 2.0
- 1 x RS-232/422/485, 1 x RS-232
- 10.1″ industrial-grade LCD screen
- 10-point capacitive touch screen
- Front panel IP65 protection
Intel® Atom® J6412 Processor 3 x LAN (2 x Intel i210 supports PoE, 1 x Intel i226) 1 DP, 1 HDMI 2 x USB 3.0, 2 x USB 2.0 1 x RS-232/422/485, 1 x RS-232 10.1″ industrial-grade LCD screen 10-point capacitive touch screen Front panel IP65 protection
P101-1G
- Intel® Alder Lake-N Series N97 Processor
- 1 x DP, 1 x HDMI
- 3 x LAN (2 x Intel i210 supports PoE, 1 x Realtek RTL8111H)
- 3 x USB 3.0, 1 x USB 2.0
- 1 x RS-232/422/485, 1 x RS-232, supports Max. extension up to 6COM
- 10.1″ industrial-grade LCD screen
- 10-point capacitive or 5-wire resistive touch screen
- Front panel IP65 protection
Intel® Alder Lake-N Series N97 Processor 1 x DP, 1 x HDMI 3 x LAN (2 x Intel i210 supports PoE, 1 x Realtek RTL8111H) 3 x USB 3.0, 1 x USB 2.0 1 x RS-232/422/485, 1 x RS-232, supports Max. extension up to 6COM 10.1″ industrial-grade LCD screen 10-point capacitive or 5-wire resistive touch…
P121-2G
- Intel® Alder Lake-N N97/I3-N305
- 1 x DP, 1 x HDMI
- 3 x LAN (2 x Intel i210 supports PoE, 1 x Realtek RTL8111H)
- 3 x USB 3.0, 1 x USB 2.0
- 1 x RS-232/422/485, 1 x RS-232, supports Max. extension up to 6COM
- 12.1″ industrial-grade LCD screen
- 10-point capacitive or 5-wire resistive touch screen
- Front panel IP65 protection
Intel® Alder Lake-N N97/I3-N305
LAN*3, COM Up to 6, USB*4
IP65, 12.1″ industrial-grade LCD screen
P156-2G
- Intel® Alder Lake-N Series N97/I3-N305 Processor
- 1 x DP, 1 x HDMI
- 3 x LAN (2 x Intel i210 supports PoE, 1 x Realtek RTL8111H)
- 3 x USB 3.0, 1 x USB 2.0
- 1 x RS-232/422/485, 1 x RS-232, supports Max. extension up to 6COM
- 15.6″ industrial-grade LCD screen
- 10-point capacitive or 5-wire resistive touch screen
- Front panel IP65 protection
Intel® Alder Lake-N Series N97/I3-N305 Processor 1 x DP, 1 x HDMI 3 x LAN (2 x Intel i210 supports PoE, 1 x Realtek RTL8111H) 3 x USB 3.0, 1 x USB 2.0 1 x RS-232/422/485, 1 x RS-232, supports Max. extension up to 6COM 15.6″ industrial-grade LCD screen 10-point capacitive or 5-wire resistive touch…
E512-AS
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- H470 /Q470 Chipset
- 11 GbE LAN(10x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 6 USB3.0
- 1RS-232/422/485, 1 RS-232
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Intel® 10-11th generation Core™ i3/ i5/ i7 CPU
LAN*11 COM*2 USB*6
Motion Control/Machine Vision
P215-2G
- Intel® Alder Lake-N Series N97/I3-N305 Processor
- 1 x DP, 1 x HDMI
- 3 x LAN (2 x Intel i210 supports PoE, 1 x Realtek RTL8111H)
- 3 x USB 3.0, 1 x USB 2.0
- 1 x RS-232/422/485, 1 x RS-232, supports Max. extension up to 6COM
- 21.5″ industrial-grade LCD screen
- 10-point capacitive touch screen
- Front panel IP65 protection
Intel® Alder Lake-N N97/I3-N305
LAN*3, COM Up to 6, USB*4
IP65, 21.5″ industrial-grade LCD screen
C100-100
- Compatible with PCI Express x4 Gen2
- 4 Ethernet ports controlled by independent network controller (4 x Intel i210)
- Supports Time Sensitive Network( TSN )
- Supports IEEE 802.3af/at PoE
- Multiple cards and multiple cameras can be connected in one system
- Power receiving device (PD) automatic detection and classification
- 0°C to 70 °C operating temperature, Supports capturing images in extreme environments without losing frames
Industrial Ethernet & Vision Module
PCI Express x4 Gen2 compatible
4 independent Intel® i210 GbE ports, with PoE
Zero frame-loss capture (0°C to 70°C)
C100-110
- Compatible with PCI Express x4 Gen2
- 4 Ethernet ports controlled by independent network controller (4 x Intel i210)
- Supports full-duplex and half-duplex operation
- Multiple cards and multiple cameras can be connected in one system
- Power receiving device (PD) automatic detection and classification
- 0°C to 70 °C operating temperature, Supports capturing images in extreme environments without losing frames
Compatible with PCI Express x4 Gen2 4 Ethernet ports controlled by independent network controller (4 x Intel i210) Supports full-duplex and half-duplex operation Multiple cards and multiple cameras can be connected in one system Power receiving device (PD) automatic detection and classification 0°C to 70 °C operating temperature, Supports capturing images in extreme environments without…
C110-320
- Compatible with PCI Express x4 Gen2
- 4 Ethernet ports(i226) controlled by independent network controller
- Supports full-duplex and half-duplex operation
- Multiple cards and multiple cameras can be connected in one system
- Power receiving device (PD) automatic detection and classification
- 0°C to 70 °C operating temperature, Supports capturing images in extreme environments without losing frames
Compatible with PCI Express x4 Gen2 4 Ethernet ports(i226) controlled by independent network controller Supports full-duplex and half-duplex operation Multiple cards and multiple cameras can be connected in one system Power receiving device (PD) automatic detection and classification 0°C to 70 °C operating temperature, Supports capturing images in extreme environments without losing frames
C120-100
- Compatible with PCI Express x4 Gen2
- 2 Ethernet ports controlled by independent network controller (2 x Intel i210)
- Supports full-duplex and half-duplex operation
- Multiple cards and multiple cameras can be connected in one system
- Power receiving device (PD) automatic detection and classification
- 0°C to 70 °C operating temperature, Supports capturing images in extreme environments without losing frames
Compatible with PCI Express x4 Gen2 2 Ethernet ports controlled by independent network controller (2 x Intel i210) Supports full-duplex and half-duplex operation Multiple cards and multiple cameras can be connected in one system Power receiving device (PD) automatic detection and classification 0°C to 70 °C operating temperature, Supports capturing images in extreme environments without…
E511-C
- Intel® 12-14th GenCore™i3/ i5/ i7 Processor
- H610/H670/Q670 Chipset
- 3 LAN（2×Intel i210, 1×Intel i219）
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 4 USB3.2, 4 USB2.0 (H610) or 6 USB3.2, 2 USB2.0 (H670/Q670) support 2 SATA RAID (support RAID 0/RAID 1, switchable in BIOS)
- 1 RS-232/422/485,3 RS-232/485, 2 RS-232
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Intel® 10-11th generation Core™ i3/ i5/ i7 CPU
LAN*3 COM*6 USB*8
Motion Control/Machine Vision
E512-C
- Intel® 12-14th Gen Core™i3/i5/i7 Series CPU
- H610/H670/Q670 Chipset
- 6 LAN（5 x Intel i210, 1 x Intel i219）
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 4 USB3.2, 4 USB2.0 (H610) or 6 USB3.2, 2 USB2.0 (H670/Q670) support 2 SATA RAID (support RAID 0/RAID 1, switchable in BIOS)
- 1 RS-232/422/485,2RS-232/485,1RS-232
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Intel® 12-14th Gen Core™ i3/i5/i7 Series CPU
LAN*6 COM*4 USB*8
Motion Control/Machine Vision
EA510F
- Intel® Core™ Ultra Processors Arrow Lake U/H Series CPU
- 7x Intel i210 GbE LAN
- 3 independent display via 2 DP and 1 VGA
- 4 x USB3.0 (1 x USB Type-C, 3x USB Type-A)
- 2x COM (1x RS-232/422/485,1x RS-232)
- 16 DI, 16 DO
- Supports 4G/5G, Wi-Fi module expansion
- Up to 99 TOPS AI computing power
Intel® Core™ Ultra Processors Arrow Lake U/H Series CPU, Up to 99 TOPS
LAN*7 COM*2 USB*4, 16 DI/16 DO
Machine Vision/Motion Control/Edge AI
AR100
- Intel® Panther Lake Core Ultra Series 3 processors
- 16G/32G LPDDR5X，On board 256G SSD
- 5 x GbE LAN ( Intel® Ethernet Controller I210-AT)
- 4 x USB3.2 Type-C，3 x USB2.0 Header
- 1 x RS-232, 5 x RS-485
- 1 x IMU（BMI088）
- 1 x MIPI CSI（ Support GMSL Module）
- 16DI 16DO(10K), 2 x Can FD
- 1 x Mic in/Line out
- 131.5 x 117 x 129 mm(L x W x H)
- Rugged design, ready for Embodied AI
Intel® Core™ Ultra Series 3 Panther Lake processors
LAN*5 Type-C*4, COM*6, USB*3, with IMU&MIPI CSI, 16DI/16DO
Up to 180TOPS computing power, designed for embodied AI
RXE-8200
- Intel® Core™ Ultra Series 3 Panther Lake processors
- 16G/32G LPDDR5X，On board 256G SSD
- 2 x GbE LAN ( Intel® Ethernet Controller I210-AT)
- 1x USB2.0 Header
- 9-36V DC-in
- 125 x 95 x 1.6 mm(L x W x H)
- Up to 180TOPS computing power, designed for embodied AI
Intel® Core™ Ultra Series 3 Panther Lake processors
LAN*2 USB*1
Up to 180TOPS computing power, designed for embodied AI
E520-C
- Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
- H610/H670/Q670 Chipset
- 6 LAN (5 x Intel i210, 1 x Intel i219)
- 3 independent display via 1 DP, 1 HDMI and 1 VGA
- 1 RS-232/422/485, 1 RS-232
- 4 USB 3.2, 2 USB 2.0 (H610) or 6 USB3.2 (H670/Q670 support 2 SATA RAID (support RAID 0/RAID 1, switchable in BIOS)
- 1 PCIe 5.0 x16, 1 PCIe 4.0 x4(x2 signal ) , 2 PCI
- 16DI,16DO
- Supports 4G/5G, Wi-Fi module expansion
- Modular and cable-free high reliability design
Intel® 10-11th generation Core™ i3/ i5/ i7 Processor
LAN*6 COM*2 USB*8 Expansion Slot*4, 16DI/16DO
Machine Vision/Motion Control
U470/U420E
- Intel 10thgeneration i9/i7/i5/i3, Pentium, Celeron CPU
- 2 LAN (1 x Intel i225,1 x Intel i219)
- 1 HDMI,1 DVI-D, 1 VGA, 1 eDP
- 6 USB 3.0
- 8 GPIO
- 1 RS-232, 2 x RS-232/485 (PIN-Out),3xRS-232 (PIN-Out)
- 1 PCIe x16, 1 PCIe x4(x2signal), 1 PCIe x4 (x1or x4signal), 4 PCI
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
U580
- Intel LGA1200 package 10th&11thgeneration XeonW-12/i9/i7/i5/i3 all G Series CPU,TDP 125W
- 2 LAN (1 x Intel i225,1 x Intel i219)
- 2 DP, 1 HDMI, 1 DVI-D
- 10 USB 3.2 (2Gen2, 8Gen1), 2 internal USB2.0 Type-A
- 2 RS-232/422/485, 4 RS-232
- 2 PCIe x16 (2 PCIe x8signal), 4 PCIe x4(3 x4, 1 x1), 1 PCI
Working temperature: 0~50℃, with 0.7m/s airflow
Storage temperature: -40~80℃
Relative humidity: 95% @ 40°C (non-condensing)
Shock protection: With SSD: 3Grms, IEC 60068-2-64, Random, 5~500 Hz, 1hr/axis
Shock protection: With SSD: 30 G, IEC 60068-2-27, Half sine, last 11ms ESD contact discharge +/-4 KV, air discharge +/-8 KV EMC CE/FCC Class B
U680
- Intel 12-13th generation i9/i7/i5/i3 all G Series CPU,TDP 125W
- 5 PCIe expansion slots supports up to 22 GbE LAN
- 2 DP, 1 HDMI, 1 DVI-D
- 10 USB 3.2 (2Gen2, 8Gen1), 2 internal USB2.0 Type-A
- 2 RS-232/422/485, 4 RS-232
- 2 PCIe x16 (1 x16 signal, 1 x4 signal), 3 PCIe x4 (1 x4, 2 x4), 2 PCI
- Industrial level port protection, anti-static, anti-surge, ensure system stability and reliability
Intel 12-13th generation i9/i7/i5/i3 all G Series CPU
LAN*22 USB3.2*10 COM*5 Expansion Slots*5
Anti-static, anti-surge
C200-210
- PCI Express x 4 Gen2 slot
- 4 x USB3.0,controlled by 4 independent controller
- Redundant power supply design, each power port Supports 8A input
- Compatible with USB 3.0 specification and Intel® xHCI specification revision 1.0
- Supports Windows 7/8/10, Linux
PCI Express x 4 Gen2 slot 4 x USB3.0,controlled by 4 independent controller Redundant power supply design, each power port Supports 8A input Compatible with USB 3.0 specification and Intel® xHCI specification revision 1.0 Supports Windows 7/8/10, Linux
C200-211
- PCI Express x 4 Gen2 slot
- 8 x USB3.0,controlled by 4 independent controller
- Redundant power supply design, each power port Supports 8A input
- Compatible with USB 3.0 specification and Intel® xHCI specification revision 1.0
- Supports Windows 7/8/10, Linux
PCI Express x 4 Gen2 slot 8 x USB3.0,controlled by 4 independent controller Redundant power supply design, each power port Supports 8A input Compatible with USB 3.0 specification and Intel® xHCI specification revision 1.0 Supports Windows 7/8/10, Linux
RXE-5300
- Intel® 12thGenAlder Lake-P platform CPU
- 1 x DP, 1 x HDMI, 1 x eDP/LVDS
- 2 xIntel i210-AT GbE LAN (Support POE function)
- 6 x USB 3.0, 3 x internal USB 2.0
- Support 1 x RS-232/422/485, 1 x RS-232 and 8-bit GPIO
IEM-2160
- Intel Apollo Lake N3350/N4200/J3355/J3455/J4205 SoC
- LPDDR4 up to 8GB memory
- 2 x 64 Pin Connectors
- Dual Independent Display: 48-bit LVDS, VGA, DP/HDMI
- 2 x COM, 1 x SATA, 1 x M.2, 5 x USB, 1 x GbE LAN
- 1 x Board to Board Connector supports 4 PCIe x1/1 USB3.0/LPC/SMBus
- CE/FCC Class B, ESD 8KV/15KV
- Windows 10/11, Centos 7/8, Ubuntu 18.04/20.04/22.04
Intel Apollo Lake N3350/N4200/J3355/J3455/J4205 SoC LPDDR4 up to 8GB memory 2 x 64 Pin Connectors Dual Independent Display: 48-bit LVDS, VGA, DP/HDMI 2 x COM, 1 x SATA, 1 x M.2, 5 x USB, 1 x GbE LAN 1 x Board to Board Connector supports 4 PCIe x1/1 USB3.0/LPC/SMBus CE/FCC Class B, ESD 8KV/15KV Windows…
IEM-3160
- Intel® Atom N3350/N4200/J3455/J3455
- LPDDR4 up to 8GB memory
- 3 independent display: DP, VGA, eDP/ LVDS
- 2 LAN (2 x Intel i225-V)
- 1 x USB2.0, 3 x USB 3.0
- 1 RS-232/422/485, 1 RS-232
- Supports 4G/5G, Wi-Fi module expansion
- Supports PCIe X1/USB2.0/GPIO/TTL/HDA expansion via BTB connector
- 8 GPIO
- DC 9 to 36V, Optional UPS module
- 146 x 102mm (L x W)
Working temperature: 0~60℃, with 0.7m/s airflow
Storage temperature: -40~85℃
Relative humidity: 95% @ 40°C (non-condensing) EMC CE/FCC Class B
IEM-3170
- Intel® Alder Lake-N Series N50/ N97/ N200/ i3-N305
- Single channel DDR5,Max. capacity16GB
- HDMI, eDP/ LVDS (BIOS control)
- 3 LAN (3 x Intel i210,supports 2 PoE)
- 3 USB 3.0, 3 USB 2.0
- 2 RS-232/485, 2 RS-232, 2 TTL
- supports 4G/5G, WiFi Expansion
- 8 GPIO, 1 Audio, 1 SATA3.0, 1 I2C, 1 SMBus
- DC 12-24V
- 146 x 102mm (L x W)
- Windows 10/11, Centos 8, Ubuntu 20.04/22.04
Working temperature: 0~60℃, with 0.7m/s airflow
Storage temperature: -40~85℃
Relative humidity: 95% @ 40°C (non-condensing) EMC CE/FCC Class B
IEM-5160
- Intel® Atom/ Celeron Elkhart J6412/ N6210/ X6425E
- Dual channel DDR4-3200 up to 64GB memory
- 3 independent display: DP, HDMI, eDP/ LVDS(BIOS control)
- 3 LAN (2 x Intel i210 supports PoE optional, 1 x Intel i226-V)
- 2 USB2.0, 2 USB3.0
- 1 RS-232/422/485, 1 RS-232
- Supports 4G/5G, Wi-Fi module expansion
- Supports PCIe X1/USB2.0/GPIO/TTL/HDA expansion via BTB connector
- 8GPIO, 1eSPI
Working temperature: 0~60°C, expandable -40°~85°C
Storage temperature: -40~85℃
Operating relative humidity: 95% @ 40°C (non-condensing)
Non-operating relative humidity: 95% @ 60°C (non-condensing)
IEM-5170
- Intel® Alder Lake-N N50, N97, N200, i3-N305
- Single channel DDR5-4800 up to 16GB memory
- 3 independent display: DP, HDMI, eDP/ LVDS(BIOS control)
- 3 LAN (2 x Intel i210 supports PoE function, 1 x Realtek RTL8111H)
- 3 USB3.0, 1 USB2.0
- 2 COM (1 RS-232/422/485, 1 RS-232)
- Supports 4G/5G, Wi-Fi module expansion
- Supports PCIe X1/USB2.0/GPIO/TTL/HDA expansion via BTB connector
- 8GPIO, 1eSPI
Working temperature: 0~60°C, expandable -40°~85°C
Storage temperature: -40~85℃
Operating relative humidity: 95% @ 40°C (non-condensing)
Non-operating relative humidity: 95% @ 60°C (non-condensing)
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