IEM-2160 – Future Robot

Future Robot

IEM-2160

  • Intel Apollo Lake N3350/N4200/J3355/J3455/J4205 SoC
  • LPDDR4 up to 8GB memory
  • 2 x 64 Pin Connectors
  • Dual Independent Display: 48-bit LVDS, VGA, DP/HDMI
  • 2 x COM, 1 x SATA, 1 x M.2, 5 x USB, 1 x GbE LAN
  • 1 x Board to Board Connector supports 4 PCIe x1/1 USB3.0/LPC/SMBus
  • CE/FCC Class B, ESD 8KV/15KV
  • Windows 10/11, Centos 7/8, Ubuntu 18.04/20.04/22.04
  • Product Details
  • Specification
  • Application
  • Download
1

Maximum Compute Density in a 100 x 72mm Module Footprint

The IEM-2160 delivers Intel Atom® and Celeron® processing across N3350, J3355, J3455, and N4200 processor options in a 100 x 72mm COM footprint, allowing system designers to match compute performance precisely to the application. LPDDR4 memory up to 8 GB covers the data requirements of standard visualization and control workloads, while the onboard M.2 M-Key slot and SATA3.0 interface provide flexible local storage configuration without adding board area. Three independent display outputs spanning DP/HDMI, VGA, and LVDS support simultaneous multi-screen configurations directly from the module.

2

Flexible I/O Expansion via High-Density Board Connectors

The module exposes its full I/O capability through high-density board-to-board connectors, giving carrier board designers access to display outputs, USB, PCIe, serial interfaces, GPIO, and audio without additional chips on the module. This architecture gives system integrators the full bandwidth of the underlying platform without routing constraints, enabling carrier boards tailored to specific application requirements across machine vision, edge AI, and motion control use cases.

3

Industrial-Grade Reliability for Embedded Deployments

The module operates continuously across 0 to 60°C with a programmable watchdog timer protecting embedded applications against unattended software faults. Internal M.2 slots accommodate Wi-Fi and 4G/5G expansion where wireless connectivity is required. CE and FCC Class B certification covers deployment in regulated industrial environments.

Specifications

Item Sub-Items Description
Processor System CPU Intel Apollo Lake N3350/N4200/J3355/J3455/J4205 SoC
TDP 10W
BIOS AMI UEFI BIOS at 64 Mbit SPI
Memory Technology LPDDR4 (-40°C-95°C Optional)
Capacity 4 GB
Graphics Controller Intel HD Graphics
Display DP/HDMI(Optional) 1 (Resolution up to 4096 x 2304 @ 60 Hz)
LVDS 1 (Resolution up to 1920 x 1200 @ 60 Hz)
VGA 1 (Resolution up to 1920 x 1200 @ 60 Hz)
Dual-Display DP+LVDS or DP+VGA or LVDS+VGA
Ethernet Interface 10/100/1000 Mbps
Controller GbE LAN1: Intel I211-AT or I210-AT
Audio Controller ALC662-VD0-GR (Co-lay ALC897)
Storage M.2 2280 Support >1T SSD
SATA 1 (600M/S)
Expansion 64-Pin connector 1 12V DC input/Inverter/VGA/2XUSB2.0/1GbE/LED
64-Pin connector 2 SMBus/I2C/ Power/Reset button/HDD/Power LED/2 x USB2.0/8-bit GPIO/ HD Audio Line-in/ Line out/ Mic-in/ 2 x RS-232/422/485
BTB Connector SMBus/USB3.0/LPC/4 x PCIe x1/Line out/DisplayPort/HDMI*/+5 Vsb/+12 Vsb power/Power On/Reset
Mini-PCIe 1 x Full-size
Power Requirement Test Environment Intel Apollo lake N4200 LPDDR4 2GB X2
Environment Temperature Operating 0 ~ 60 °C (32 ~ 140 °F)
Non-Operating -40 ~ 85 °C (-40 ~ 185 °F)
Humidity Operating 40 °C @ 95% RH Non-condensing
Non-Operating 60 °C @ 95% RH Non-condensing
Physical Characteristics Dimensions (L x H) 100 x 72 mm

Dimensions

1675409362405344

Interfaces

1675410069640700

1676364866472765

IEM 2160 Series Single Board Computer Datasheet

Size: 2 MB

We’re just a message away! Let us help with your needs.