E531-C – Future Robot

Future Robot

E531-C

  • Intel® 12-14th Gen Core™ i3/ i5/ i7 Series
  • H610/H670/Q670 Chipset
  • 3 independent display via 1 DP,1 HDMI and 1 VGA
  • 3GbE LAN(2x Intel i210, 1 x Intel i219)
  • 1 RS-232/422/485, 3 RS-232/485, 2 RS-232
  • 4 USB3.2, 4 USB2.0 (H610) or 6 USB3.2, 2 USB2.0 (H670/Q670 support 2 SATA RAID (support RAID 0/RAID 1, switchable in BIOS)
  • 1 PCIe 5.0 x16, 1 PCIe 4.0 x2(H610) ; 1 PCIe 5.0 x16 or 2 PCIe x8, 1 PCIe 4.0 x2(H670/Q670)
  • 800W Power Supply
  • Product Details
  • Specification
  • Application
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1

Server-Grade Power for Intensive Edge GPU Acceleration

True edge AI deployments demand discrete GPU compute without compromising on power delivery or stability. The E531-C answers this by integrating a massive 800W AC power supply alongside a PCIe 5.0 x16 slot purpose-built to host high-performance GPUs. With an optional second PCIe x8 slot for dual-accelerator configurations, paired with 3 GbE LAN ports and 6 COM ports, it delivers the raw electrical and computational headroom required to run heavy inference workloads and complex device control on a single, unified node.

2

Server-Grade Power for Intensive Edge GPU Acceleration

True edge AI deployments demand discrete GPU compute without compromising on power delivery or stability. The E531-C answers this by integrating a massive 800W AC power supply alongside a PCIe 5.0 x16 slot purpose-built to host high-performance GPUs. With an optional second PCIe x8 slot for dual-accelerator configurations, paired with 3 GbE LAN ports and 6 COM ports, it delivers the raw electrical and computational headroom required to run heavy inference workloads and complex device control on a single, unified node.

3

Next-Generation Bandwidth for Edge AI and Complex Integration

Advanced edge AI and high-speed inspection demand massive data throughput and uncompromising CPU headroom. The 12th through 14th generation Intel Core architectures shift the computing paradigm, delivering a massive leap in multi-core processing power. This enhanced compute density is paired with ultra-fast PCIe 5.0 capabilities and next-generation DDR5 memory. By fundamentally widening the overall data pipeline, this platform provides the ultimate foundation to unleash the full potential of bandwidth-hungry AI accelerators and high-density expansion cards under extreme workloads.

4

Wall-Mount Ready, 3 Displays Supported

The platform installs directly on the control cabinet wall without requiring a rack enclosure. 1 DP, 1 HDMI, and 1 VGA output support 3 independent displays simultaneously, allowing operators to run HMI, process monitoring, and diagnostics on separate screens from a single centralized unit. An optimized thermal design ensures reliable, sustained operation at temperatures from 0 to 50°C.

5

High Reliability

The platform accepts DC 24V input with an optional UPS module, while the cable-free modular internal architecture and watchdog timer ensure continuous operation through power fluctuations and software faults alike.

Specifications

E531-C Series
CPU CPU Intel® 12-14th Gen Core™ Processors
TDP Max 65W
Socket LGA1700
Chipset H610/H670/Q670
BIOS AMI 128Mbit SPI Flash
Memory Technology Dual channel 262-pin DDR5 SO-DIMM
Max. Capacity Max 64GB
Graphic Controller Intel UHD Graphics 770
External I/O DP 1 x DP1.4a, resolution up to 4096x2304@60Hz
HDMI 1 x HDMI2.0b, resolution up to 4096 x 2160@60 Hz
VGA 1 x VGA, resolution up to 1920 x 1200@60Hz
LAN 2 x Intel i210 GbE, 1 x Intel i219 GbE
USB 3.2 H610: 4 USB3.2 (2 x GEN1, 2 x GEN2) Q670/H670: 6 USB3.2 (GEN2)
USB 2.0 H610: 4 USB2.0 Q670/H670: 2 USB2.0
Serial Port COM 1: RS-232/422/485, COM 2&6: RS-232, COM 3&4&5: RS-232/485
audio 1 x Line out, 1 x Mic in
Remote 1 x Remote
LED & Switch Reset 1 xReset
Power Button 1 xPower Button
LED 4 (SSD, Memory, User 1, User 2)
PCIe USB 2 x Internal USB2.0 (Type A)
PCIe H610: 1 PCIe 5.0 x16, 1 PCIe 4.0 x2; H670/Q670: 1 PCIe 5.0 x16 or 2 PCIe x8, 1 PCIe 4.0 x2 signal
SATA3.0 2 x SATA 7pin
M.2 E-Key 1 x M.2 2230 supports Wi-Fi (supports PCIe)
M.2 B-Key 1 x M.2 3042 B-Key supports 4G (H610), 1 x M.2 3052 B-Key supports 4G/5G (H670/Q670); or 1 x M.2 2280 supports SATA3.0
M.2 B-Key 1 x M.2 2280 B-Key SATA3.0
SIM 1 x NANO SIM
Power Supply Power Input AC 90 to 264V
Power Management AT/ATX
Max Consumption 800W
Others Watchdog 65536 grade, 0 to 65535min/sec
TPM TPM2.0(Optional)
Physical Characteristics construction aluminium alloy
Installation Wall mount
Dimension 220 x 360 x 176mm (LxWxH)
Weight 5.0Kg
Environment Operating Temperature 0 to 50°C (32 to 122°F)
Storage Temperature -40 to 85 °C (-40 to 185°F)
Operating Humidity 95% @ 40 °C(Non-condensing)
Storage Humidity 95% @ 60 °C(Non-condensing)
Certification EMC CE, FCC
OS OS Windows 10/11, Centos 8, Ubuntu 20.04/22.04

Dimensions

E531-C

 

Interfaces

E531-C-1

1676364866472765

E531F CDE Series Industrial PC Datasheet 1

Size: 1 MB

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